What to Expect?
On the first day, the event will start with the opening roundtable at 4pm. After a brief welcome, Bodo will discuss with the guests the hurdles that need to be overcome to design in WBG semiconductors today and to increase the adoption rate of SiC and GaN devices.
On the second day, Bodo will run two tracks in parallel, one for SiC and one for GaN. In the already well-proven manner Bodo will ignite a kind of firework of SiC and GaN technology presentations to inspire the audience. As Bodo’s Power Systems know, networking and the possibility to meet the experts (companies) are some of the main benefits of an event like this, so they have planned enough time for breaks and the exchange of information.
Meet Our Speakers
Accurate SiC simulation in SPICE and PLECS
SiC is still a relative new material. Every new generation brings more performances to improve system or application efficiency.
But, to compare or evaluate the advantage to move on, designer need tools to compare at system level the benefits.
SPICE, invented in the 70’s, doesn’t know SiC material and specific characteristics. onsemi build all SiC physical equations to describe SiC operation and implement then in SPICE. With such powerful SPICE models, accurate simulation results can be obtained. For every designer, losses are the focus. As we will see in this session, onsemi SPICE models can predict then if the environment is also modeled. The drawback of SPICE is the simulation time need for big system. PLECS overcomes this by using a state change technic and models including precalculated losses. As it will be demonstrated in the previous section on SPICE, system losses don’t depend only on active devices. There are interactions between active and passive devices, influencing each other’s. For this, onsemi bring a new tool: the “Self-Service PLECS Model Generator” in complement with the “Elite Power Simulator” tool, a system simulation platform based on PLECS. The model generator objective is to predict accurately the losses by including in the PLECS models the system environment and interactions between each design specific passive and active parts. The second section will show examples and comparisons between SPICE results and PLECS results. It will prove the superior accuracy of using the model generator to predict system losses.
Speaker: Didier Balocco
December 3
Panel Discussion with Mrinal Das
