Wide Bandgap Solutions

ON Semiconductor offers a complete Wide Bandgap portfolio of SiC & GaN discretes, modules, and drivers.

Wide Band Gap

Bei ON Semiconductor erhalten Sie ein komplettes Portfolio an Wide Band Gap-Halbleitern in Form von diskreten Bausteinen, Modulen und Treibern in SiC- und GaN-Technologie.

Auxiliary Power

ON Semiconductor offers a wide portfolio of PoL devices and linear regulators to meet a wide range of voltage and current requirements, including a growing 48 V compatible family.

Core Power

The microprocessor and GPU brains which crunch the data of our lives are difficult, dynamic loads. Mulitphase power supplies provide the efficiency across load and fast response for computing in a range of applications.

Hot Swap

The ability to hot swap memory, drives, or other peripherals is a key functionality of server, computing, and telecom hardware. ON Semiconductor’s load switch and eFuse portfolios provide an easy, compact, and efficient solution with the hot swap controller and MOSFET integrated into one device.

Gate Driver Solutions

Every switch needs a gate driver. Gate Driver Products are the interface between control signals (from a digital or analog controller) and power switches (IGBTs, MOSFETs, SiC MOSFETs, and GaN HEMTs). Their additional functions can include level shifting, isolation, fault sensing and signal conditioning. We offer a broad selection tailored for a variety of power switches, topologies and applications. ON Semiconductor’s diverse portfolio of gate drivers contains the right solution for a range of systems including Automotive, Industrial, Cloud and Telecom applications.

Gate Driver Products

*Click on the products in the table to learn more.

Configuration 20-36V 100-300V 600-700V 900V 1200V
Single Channel Low-side
High-side
Dual Channel Low-side
High-side
High-side and Low-side
Half-bridge
4 Channel Full-bridge
6 Channel Three-phase

Gate Driver Categories

IGBT
Drivers
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MOSFET
Drivers
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SiC MOSFET
Drivers
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GaN
Drivers
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Opto Isolated
Drivers
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Design Resources - Evaluation Boards


Gate Driver Plug and Play >

SECO−GDBB−EVB is a baseboard conceived for use as a plug and play environment for testing various types of gate drivers. The board enables to feed the drivers with the same control signal under same conditions and compare their capabilities. It is set up to accommodate up to six driver boards (daughter boards) designed to test gate drivers functions and features (all driver boards are pin compatible with baseboard).

Main PCB Structure


Daughter Mini Board Structure


Gate Driver Category by Isolation

Non-Isolated > Junction Isolated > Galvanic Isolated >
  • Single or Multiple Channel
  • Cheapest, simple solution for many
    applications where only a low-side driver
    is needed

  • Normally needed in very high power/high voltage
    systems and Single Phase
  • Three options: Optical, Inductive, Capacitive
Applications

Gate Driver Isolation Options


Single Isolated


Galvanic isolation is provided in the gate drive PWM logic signal from the controller using a part such an optocoupler or digital isolator. Then the isolated PWM signal is fed to the gate driver to turn on and off the switch.


Characteristics:

  • Not commonly used
  • Layout can be complex due to extra IC's
  • Decoupling Caps extra cost
  • GND noise Common Mode choke could be required
  • APPS-Low to Med Power; Afterthought Isolation need it if long cables are used
Junction Isolation


A junction isolated gate driver does not provide true galvanic isolation. A semiconductor junction in the driver allows a floating well to rise and fall with the switch node, and therefore be able to control the high side gate.


Characteristics:

  • Low cost
  • Easy layout
  • Need to select Boost Diode and Cap with care for speed/ratio noise
  • Possible Cap needed for cross-coupling reduction due to NO galvanic Isolation
  • APPS-DC-DC; PFC; Small-Med Motor drivers; Consumer Appliances; Med Power UPS<3KW
Galvanic Isolation


Galvanic isolation allows power or signal transfer between two electrical circuits without a shared current flow (circuits separately grounded). This can increase the reliability and safety of power systems and protects sensitive circuits from transients.


Inductive / Coreless transformer

  • The magnetic field coupling between inductors carries the signal across the isolation boundary.

Capacitive Isolation

  • The electric field between parallel plates (capacitor) carries the signal across the isolation boundary.

Optocoupler

  • Photons from an LED are detected by a photdiode to transmit the signal across the isolate boundary.

Characteristics:

  • IC is complex; all Intergrated
  • Full protection features
  • Higher cost/Highest safety
  • Ease of Layout, no extra components
  • APPS-High Power AC/BLDC Motors; Industrial SMPS; Solar Inverters; High Power UPS>3KW

Server Rack Power

The size, density and sheer number of datacenters is rapidly growing, which is driving increasing need for efficiency. The largest operational cost for data centers is electricity. Improving the power conversion efficiency at every stage in the power distribution architecture is a critical factor to reduce cost. Emerging applications, such as artificial intelligence, machine-to-machine connectivity and cloud computing, are driving the need for higher rack power density, in addition to the challenge of adapting to a 48 V backplane.

Gate Driver Solutions

Every switch needs a gate driver. Gate Driver Products are the interface between control signals (from a digital or analog controller) and power switches (IGBTs, MOSFETs, SiC MOSFETs, and GaN HEMTs).
Features

Featured Asset

Resources

We’ve created specific design resources to help you make power conversion and motor control solutions like renewable energy products, cloud-enabled data centers, variable speed motor drives, and lighting products last longer, use less energy, and run more reliably.

Unsere spezifischen Designressourcen unterstützen Sie dabei, Ihre Lösungen zur Leistungsumwandlung und Motorsteuerung langlebiger, energiesparender und zuverlässiger zu gestalten – etwa Produkte im Bereich der erneuerbaren Energien, Cloud-fähige Rechenzentren, drehzahlvariable Antriebe und Beleuchtungen.

Media

Power Conversion & Motor Control blog
More Blog Posts…

How onsemis Power and Motor Control Solutions can be used for Autonomous Mobile Robots - 2023-06-27 19:12:30.519119
Totem-pole PFC and SiC Combine to Improve Power Supply Density and Efficiency - 2023-05-18 22:30:10.474402
The 2021 Technology Outlook for Silicon Carbide Semiconductors - 2021-02-26 19:10:42.892112

Power Conversion & Motor Control videos
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Transfer Molded Power Integrated Module (TMPIM) for Motor Drive Demo
TMPIM or Transfer Molded Power Integrated Modules use epoxy molding compounds to encapsulate IGBTs and diodes through a transfer molding process. TMPIM offer high reliability, high efficiency, fast switching, low switching loss, and low thermal resistance. TMPIM from ON Semiconductor feature (CI) Converter Inverter, (CIB) Converter Inverter Brake, and Six-pack topologies, covering 650 volts at currents from 35 amps to 200 amps and 1200 volts at currents from 25 amps to 150 amps. Also, the modules are compliant with the IEC61800-5-1 and UL1557 standards. ON Semiconductor TMPIM modules integrated with optimum IGBTs and diodes provide high-efficiency and robustness, benefitting customer applications such as motor drives and HVAC applications with high lifetime and high reliability. Also, the high power density of the modules helps prevent dendrite formation between the copper pads in the modules. Together these optimal operating characteristics enable the modules to work under conditions of some corrosive gases in hazardous environments. This demo features a VFE motor drive purchased from a public market in which we replace the CIB power module with an ON Semiconductor TMPIM module.
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