Material Composition

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	Die Attach Solder						Plating		Die		Wire Bond - Al		Case					Coating									DBC			Glue				Interconnect				Terminal					Thermistor																		TOTAL
			Dimethyl phthalate [%]	Amines [%]	Isotridecan-1-ol [%]	Silver (Ag) [%]	Tin (Sn) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	2,2'-[(1-Methylethylidene)bis[(dibromo-4,1-phenylene)oxymethylene]]bis[oxirane]-4,4'-(1-methylethylidene)bis[2,6-dibromophenol] copolymer [%]	Fiber Glass (SiO2) [%]	Antimony Trioxide (Sb2O3) [%]	PBT [%]	Weight [mg]	Acrylised oligomer [%]	2-ethylanthraquinone [%]	Pentaaerythritol acrylate [%]	Glycerol, propoxylated, esters with acrylic acid [%]	2,2-bis(acryloyloxymethyl)butyl acrylate [%]	2-hydroxyethyl methacrylate [%]	Epoxyacrylate [%]	Silicon Dioxide (SiO2) [%]	Weight [mg]	Aluminum Trioxide (Al2O3) [%]	Copper (Cu) [%]	Weight [mg]	2,3-epoxypropyl-trimethoxysilan [%]	Miscellaneous [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Zinc Monoxide (ZnO) [%]	Silicon (Si) [%]	Aluminum (Al) [%]	Weight [mg]	Silicon (Si) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Copper chromite black spinel [%]	Titanium Dioxide (TiO2) [%]	Silver (Ag) [%]	Boron Trioxide (B2O3) [%]	Tin (Sn) [%]	Lead Oxide (PbO) [%]	Zinc Monoxide (ZnO) [%]	Silica Amorphous (SiO2) [%]	Misc. [%]	Palladium (Pd) [%]	Barium Monoxide (BaO) [%]	Aluminum Trioxide (Al2O3) [%]	Ruthenium Oxide (RuO2) [%]	Nickel (Ni) [%]	Cobalt Oxide (Co3O4) [%]	Manganese Tetraoxide (Mn3O4) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Weight [mg]
			131-11-3	61788-95-2	27458-92-0	7440-22-4	7440-31-5	n/a	7440-31-5	n/a	7440-21-3	n/a	7429-90-5	n/a	68928-70-1	65997-17-3	1309-64-4	26062-94-2	n/a	proprietary data	84-51-5	4986-89-4	52408-84-1	15625-89-5	868-77-9	proprietary data	112945-52-5	n/a	1344-28-1	7440-50-8	n/a	2530-83-8	trade secret	14808-60-7	n/a	1314-13-2	7440-21-3	7429-90-5	n/a	7440-21-3	7440-02-0	7440-50-8	7723-14-0	n/a	68186-91-4	13463-67-7	7440-22-4	1303-86-2	7440-31-5	1317-36-8	1314-13-2	7631-86-9	proprietary data	7440-05-3	1304-28-5	1344-28-1	12036-10-1	7440-02-0	1308-06-1	1317-35-7	14808-60-7	n/a	n/a
NXH50M65L4Q1	NXH50M65L4Q1PTG	Active	1	1	1	4	93	500	100	15.5	100	86.7	100	94.5	11	30	4	55	17500	2	1	2	10	10	15	10	50	1500	42	58	13654	10	10	80	5740	10	30	60	830	0.27	1.35	98.355	0.025	115.12	0.4	0.18	1.67	0.38	2.3	2.61	0.05	0.8	1.98	0.09	0.04	84.53	0.03	2.82	0.09	0.19	1.84	4.81902	40040.63902
NXH50M65L4Q1	NXH50M65L4Q1SG	Active	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.