Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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4 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Exempt	Mold Compound-Black						Lead Frame				Die Attach Solder				Plating		Die							Clip		TOTAL
					Metal Hydroxide [%]	Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Lead (Pb) [%]	Tin (Sn) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Lead (Pb) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Lead Bisilicate [%]	Arsenic (As) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
					proprietary data	29690-82-2	1333-86-4	60676-86-0	9003-35-4	n/a	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	7439-92-1	7440-31-5	n/a	7440-31-5	n/a	7439-92-1	7440-21-3	7440-02-0	7440-57-5	65997-18-4	7440-38-2	n/a	7440-50-8	n/a	n/a
ES3J	ES3J	Active	Y	7a 7c	3.5	8	0.5	80	8	132	0.12	99.85	0.03	90.9231	2.5	92.5	5	4.36	100	1.4189	4.8	93.8	0.9	0.5			3.798			232.5
S3JB	NRVS3JB	Active	Y	7a 7c	3.5	8	0.5	80	8	48.755	0.12	99.85	0.03	26.802	2.5	92.5	5	2.3616	100	0.2016		90	0.65	0.15	9.2		1.2132	100	10.667	90.0004
S3J	S3J	Active	Y	7a 7c	3.5	8	0.5	80	8	132	0.12	99.85	0.03	90.9231	2.5	92.5	5	4.36	100	1.4189	4.8	93.8	0.9	0.5			3.798			232.5
S3JB	S3JB	Active	Y	7a	3.5	8	0.5	80	8	54.234	0.12	99.85	0.03	34.0437	2.5	92.5	5	2.25	100	0.7083		99.28	0.15	0.55		0.02	0.764			92.0

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.