Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

Download:

Excel

Use~for the exact search match (i.e. ~NTS2101PT1).

3 Non-hybrid devices found

Non-hybrid devices

Page size:

1 - 3 of 3

Base part	Part	Status	HF	Lead Frame					Die Attach Tape						Plating				Die		Wire Bond - Au		Mold Compound						TOTAL
				Magnesium (Mg) [%]	Silicon (Si) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Weight [mg]	Oxirane, (chloromethyl)-, homopolymer [%]	2-Propenoic acid, 2-methyl-, polymer with butyl 2-propenoate and methyl 2-methyl-2-propenoate [%]	Proprietary [%]	Silica Amorphous (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Epoxy resin [%]	Phenolic Resin [%]	Silica Amorphous (SiO2) [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Weight [mg]	Weight [mg]
				7439-95-4	7440-21-3	7440-02-0	7440-50-8	n/a	24969-06-0	25035-69-2	proprietary data	7631-86-9	9003-35-4	n/a	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	proprietary data	proprietary data	7631-86-9	1333-86-4	60676-86-0	n/a	n/a
	NCD98010XDPTWG	Obsolete	Y	No data available
NCD98010	NCD98010XMXTAG	Active	Y	0.15	0.65	3	96.2	1.135	15	15	10	45	15	0.035	5	90	5	0.01	100	0.082	100	0.06	7.5	3	7.5	0.5	81.5	1.363	2.685
	NCD98010XMXTWG	Obsolete	Y	No data available

Page size:

1 - 3 of 3

Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.