Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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2 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black							Lead Frame					Die Attach							Plating					Die		Wire Bond - Cu		TOTAL
				Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Phenolic Resin (Novolac) [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Bis(a,a-dimethylbenzyl) Peroxide [%]	Isobornyl Methacrylate [%]	Silver (Ag) [%]	Isobornyl Acrylate [%]	Tricyclo[5.2.1.02,6]decanedimethanol Diacrylate (C18H24O4) [%]	Acrylic resins [%]	Weight [mg]	Silver (Ag) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Copper (Cu) [%]	Weight [mg]	Weight [mg]
				29690-82-2	1333-86-4	60676-86-0	29690-82-2	9003-35-4	14808-60-7	n/a	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	80-43-3	7534-94-3	7440-22-4	5888-33-5	42594-17-2	proprietary data	n/a	7440-22-4	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-50-8	n/a	n/a
FDMA8878	FDMA8878	Active	Y		0.5	88	6.5	5		4.878	0.141509	2.40566	97.4057	0.0471698	4.24			85			15	0.108		8.16327	89.7959	2.04082	0.049	100	0.569	100	0.035	9.879
FDMA8878	FDMA8878-F130	Active	Y	5.4987	0.19948	75.3014		14.0004	5	4.612	0.124724	2.35015	97.4432	0.0819614	4.0051	0.515464	5.54124	82.8608	5.54124	5.54124		0.0776	1.53	3.57	92.86	2.04	0.056	100	0.6023	100	0.087	9.44

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.