Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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3 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black						Lead Frame						Die Attach					Plating						Die		Wire Bond				Wire Bond - Au		TOTAL
				4,4'-Bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Epoxy resin [%]	Silver (Ag) [%]	Acrylic resins [%]	Aluminum (Al) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Palladium (Pd) [%]	Gold (Au) [%]	Copper (Cu) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				85954-11-6	1333-86-4	60676-86-0	29690-82-2	9003-35-4	n/a	7440-22-4	7440-66-6	7439-89-6	7440-50-8	7723-14-0	n/a	proprietary data	7440-22-4	proprietary data	7429-90-5	n/a	7440-22-4	7440-31-5	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-05-3	7440-57-5	7440-50-8	n/a	7440-57-5	n/a	n/a
FAN3122C	FAN3122CMPX	Active	Y		0.5	88	6.5	5	10.3333		0.124412	2.34919	97.4438	0.0825928	9.565		85	15		0.1359	1.57068		3.59013	92.8197	2.01945	0.1337	100	1.055					100	0.397	21.6199
FAN3122C	FAN3122CMX	Active	Y	4.5	0.5	92		3	45.29	5	0.12	2.4	92.4	0.08	31.136	13	35	17	35	1.144		100				3.44	100	2.16	3.1	0.35	96.55	0.314			83.484
FAN3122C_F085	FAN3122CMX-F085	Obsolete	Y	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.