Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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3 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Mold Compound-Black							Lead Frame									Die Attach				Plating					Die		Wire Bond - Au		TOTAL
				Ortho Cresol Novolac Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Silica (SiO2) [%]	Phenolic Resin (Novolac) [%]	Weight [mg]	Silver (Ag) [%]	Zinc (Zn) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Silver (Ag) [%]	Phenolic Resin-2 [%]	Acrylic resins [%]	Weight [mg]	Silver (Ag) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Gold (Au) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
				29690-82-2	1333-86-4	60676-86-0	29690-82-2	14464-46-1	9003-35-4	n/a	7440-22-4	7440-66-6	7440-05-3	7440-02-0	7440-57-5	7439-89-6	7440-50-8	7723-14-0	n/a	7440-22-4	54208-63-8	proprietary data	n/a	7440-22-4	7440-05-3	7440-02-0	7440-57-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
FAN3121T	FAN3121TMPX	Active	Y		0.5	88	6.5		5	10.3333		0.124412				2.34919	97.4438	0.0825928	9.565	85		15	0.1359	1.57068	3.59013	92.8197	2.01945	0.1337	100	1.055	100	0.397	21.6199
FAN3121T	FAN3121TMX	Obsolete	Y	No data available
FAN3121T_F085	FAN3121TMX-F085	Last Shipments	Y	6.24862	0.198719			87.0391	6.51358	45.29	0.0221722	0.123531	0.047512	1.27966	0.0285072	2.31858	96.0977	0.0823541	31.571	74	26		1.144						100	2.16	100	0.627	80.792

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.