Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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11 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	Mold Compound-Black					Lead Frame					Plating		Die		Wire Bond - Au		TOTAL
			Phenol Resin [%]	Carbon Black (C) [%]	Fused Silica (SiO2) [%]	Ortho-Cresol Novolac Resin [%]	Weight [mg]	Silver (Ag) [%]	Iron (Fe) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Weight [mg]	Gold (Au) [%]	Weight [mg]	Weight [mg]
			proprietary data	1333-86-4	60676-86-0	29690-82-2	n/a	7440-22-4	7439-89-6	7440-50-8	7723-14-0	n/a	7440-31-5	n/a	7440-21-3	n/a	7440-57-5	n/a	n/a
2N7000	2N7000	Active	10	1	77	12	112	0.01	0.1	99.86	0.03	101	100	5.85	100	0.075	100	0.076	219.001
2N7000	2N7000-D26Z	Active	10	1	77	12	112	0.01	0.1	99.86	0.03	101	100	5.85	100	0.075	100	0.076	219.001
2N7000	2N7000-D74Z	Active	10	1	77	12	112	0.01	0.1	99.86	0.03	101	100	5.85	100	0.075	100	0.076	219.001
2N7000	2N7000-D75Z	Active	10	1	77	12	112	0.01	0.1	99.86	0.03	101	100	5.85	100	0.075	100	0.076	219.001
	2N7000BU	Active	10	1	77	12	112	0.01	0.1	99.86	0.03	101	100	5.85	100	0.075	100	0.076	219.001
2N7000	2N7000G	Obsolete	No data available
2N7000	2N7000RLRA	Obsolete	No data available
2N7000	2N7000RLRAG	Obsolete	No data available
2N7000	2N7000RLRMG	Obsolete	No data available
2N7000	2N7000RLRPG	Obsolete	No data available
	2N7000TA	Active	10	1	77	12	112	0.01	0.1	99.86	0.03	101	100	5.85	100	0.075	100	0.076	219.001

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.