Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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6 Non-hybrid devices found

Non-hybrid devices

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Base part	Part	Status	HF	Die		Wire Bond - Al		Case			DBC			Glue				NTC								Silicone Gel			Solder Paste			Terminal					TOTAL
				Silicon (Si) [%]	Weight [mg]	Aluminum (Al) [%]	Weight [mg]	Fiber Glass (SiO2) [%]	PBT [%]	Weight [mg]	Aluminum Trioxide (Al2O3) [%]	Copper (Cu) [%]	Weight [mg]	2,3-epoxypropyl-trimethoxysilan [%]	Miscellaneous [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Nickel Oxide (NiO) [%]	Palladium (Pd) [%]	Nickel (Ni) [%]	Cobalt Oxide (Co3O4) [%]	Manganese Tetraoxide (Mn3O4) [%]	Weight [mg]	Silica, [(ethenyldimethylsilyl)oxy]- and [(trimethylsilyl)oxy]- modified [%]	Silica Crystalline (SiO2) [%]	Weight [mg]	Silver (Ag) [%]	Tin (Sn) [%]	Weight [mg]	Silicon (Si) [%]	Nickel (Ni) [%]	Copper (Cu) [%]	Phosphorus (P) [%]	Weight [mg]	Weight [mg]
				7440-21-3	n/a	7429-90-5	n/a	65997-17-3	26062-94-2	n/a	1344-28-1	7440-50-8	n/a	2530-83-8	trade secret	14808-60-7	n/a	7440-22-4	7440-31-5	1313-99-1	7440-05-3	7440-02-0	1308-06-1	1317-35-7	n/a	68988-89-6	14808-60-7	n/a	7440-22-4	7440-31-5	n/a	7440-21-3	7440-02-0	7440-50-8	7723-14-0	n/a	n/a
	NXH80T120L2Q0P2G	Active	Y	No data available
NXH80T120L2Q0	NXH80T120L2Q0P2TG	Last Shipments	Y	No data available
	NXH80T120L2Q0PG	Obsolete	Y	No data available
	NXH80T120L2Q0S2G	Active	Y	100	12.1154	100	80	35	65	10240	40	60	6550	10	10	80	60	0.9792	0.1998	39.1687	0.9992	0.0999	3.9968	54.5564	10	30	70	2700	3.5	96.5	210	0.27	1.35	98.355	0.025	2209.09	22071.2054
	NXH80T120L2Q0S2TG	Active	Y	No data available
	NXH80T120L2Q0SG	Obsolete	Y	No data available

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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products.

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.