Material Composition

Locate Pb-free (RoHS) and Halogen-free Material content details.

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3  Non-hybrid  devices found

Non-hybrid devices

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Base part Part Status HF Exempt Excel IPC1752 PDF IPC175X XML IPC1752A XML  Mold Compound-Black   Lead Frame   Die Attach   Plating   Die   Wire Bond - Au   TOTAL 
Ortho Cresol Novolac Resin
[%]
Carbon Black (C)
[%]
Fused Silica (SiO2)
[%]
Ortho-Cresol Novolac Resin
[%]
Silica (SiO2)
[%]
Phenolic Resin (Novolac)
[%]
Weight
[mg]
Silver (Ag)
[%]
Zinc (Zn)
[%]
Palladium (Pd)
[%]
Nickel (Ni)
[%]
Gold (Au)
[%]
Iron (Fe)
[%]
Copper (Cu)
[%]
Phosphorus (P)
[%]
Weight
[mg]
Silver (Ag)
[%]
Phenolic Resin-2
[%]
Acrylic resins
[%]
Weight
[mg]
Silver (Ag)
[%]
Palladium (Pd)
[%]
Nickel (Ni)
[%]
Gold (Au)
[%]
Weight
[mg]
Silicon (Si)
[%]
Weight
[mg]
Gold (Au)
[%]
Weight
[mg]
Weight
[mg]
29690-82-2 1333-86-4 60676-86-0 29690-82-2 14464-46-1 9003-35-4 n/a 7440-22-4 7440-66-6 7440-05-3 7440-02-0 7440-57-5 7439-89-6 7440-50-8 7723-14-0 n/a 7440-22-4 54208-63-8 proprietary data n/a 7440-22-4 7440-05-3 7440-02-0 7440-57-5 n/a 7440-21-3 n/a 7440-57-5 n/a n/a
FAN3121T FAN3121TMPX Active  Y   Download xls Download xml Download xml Download xml     0.5   88   6.5      5   10.3333      0.124412            2.34919   97.4438   0.0825928   9.565   85      15   0.1359   1.57068   3.59013   92.8197   2.01945   0.1337   100   1.055   100   0.397   21.6199 
FAN3121T FAN3121TMX Obsolete  Y           No data available
FAN3121T_F085 FAN3121TMX-F085 Last Shipments  Y   Download xls Download xml Download xml Download xml  6.24862   0.198719         87.0391   6.51358   45.29   0.0221722   0.123531   0.047512   1.27966   0.0285072   2.31858   96.0977   0.0823541   31.571   74   26      1.144                  100   2.16   100   0.627   80.792 
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Materials Disclosure Disclaimer

Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information.  

Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. 

There is no intentional use of Cadmium, Mercury, Hexavalent Chromium, Polybrominated biphenyls (PBBE), Polybrominated diphenyl ethers (PBDE), and four phthalates Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP), Diisobutyl phthalate(DIBP) (9 of the 10 RoHS banned substances) in this or any of our other products.

For further explanation on material composition calculations, please view our Product Chemical Content Brochure.


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